Shenzhen Product & Tech Recruiting Forum

November 8, 2018
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Join USC and the University of Chicago in Shenzhen for the Shenzhen Product & Tech Recruiting Forum!

This innovative and exciting event offers a unique opportunity for students to engage and network with leading companies in the tech industry. Students from across the nation who share a passion for tech will come together for the forum, compete in a product hack-a-thon, connect with each other, and network extensively with sponsor firms and employers.

The Product Hack-a-Thon, December 18-19, 2018

Students will be placed in teams of four or five to showcase skills in product design, coding, marketing, negotiations, teamwork, and communication. Teams will then pitch their concept to a panel of judges comprised of employers from participating organizations.

Participating Employers: Konka, Huawei, SenseTime, Ping An and Ourpalm


  • Open to all undergraduate class years
  • Able to commit to full event (Dec. 18-19)
  • Strong interest in a tech career in China
  • Fluent in Mandarin Chinese

For more information and to apply, please visit here.


Published on November 8th, 2018

Last updated on November 8th, 2018